兴安盟厚膜汉高ABLESTIKJM7000导电胶,JM7000导电胶

Ablestik：

导电银胶:主要经营有ABLEBOND 84-1A、84-1LMI、 84-1LMINB(B1)、 84-1LMISR4、84-1LMIT(T1)、 826-1DS、826-2、2600AT、2600BT、2185A、2030SC、2100A、3185、8290、8340、8360、8352L、968-2、979-1、71-1、JM7000等一系列产品,适用于半导体(IC)封装(如DIP/SOP/TO-92/BGA...)、LED(如普通发光二极管/LAMP/大功率管/数码管...)等领域,用于各种贴片、点胶、背胶等工艺.

绝缘胶:主要经营有ABLEBOND84-3、84-3J、84-3LV、84-3MV、789-3、789-4、2025D 、2025M、 2035SC 、8384、8387A、8387B、2039H、DX-10、DX-20-4等一系列产品,适用于半导体(IC)封装、摄像头(CMOS/CCD)工艺、LED、智能卡等领域,用于各种贴片、或有粘贴的等工艺.

UV胶:主要经营有ABLELUXHGA-3E、HGA-3S、A4021T、A4035T、A4039T、A4061T、A4083T、A4086T、A4088T、A4502、CC4310、AA50T 、BF-4 、OG RFI146T等一系列UV紫外固化胶,适用于光电、光电仪表、光纤、手机摄像头(CMOS)等领域;如手机摄像头Lens固定,光纤耦合器(Coupler),激光器(Laser),跳线(Jamper),衰减器(Attenuator),探测器(Detector)等。

胶膜:主要经营有ABLEFILM506 、508、550S、561K、570K、5020、5020K、5025E等一系列产品,适用于各种电子产品,产品,电源等。

ABLESTIK JM7000具有高可靠性，低空洞特点，耐高温可达370度。

常用超大规模集成电路封装，陶瓷焊接封装和焊接密封封装

汉高ablestik JM7000高可靠性导电胶 耐高温导电胶300度

ABLESTIK JM7000耐高温300℃导电胶

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300ºC N/mm² 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10ºC/ minute ramp from 25 to 400
ºC
@ 340ºC, % 0.2
@ 400ºC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300ºC
Volume Resistivity, ohm-cm ≤0.01
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150ºC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300ºC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300ºC
Chip Size: ROC
15 x 15 mm > 5